高热导率氮化硅散热基板材料的研究进展

摘要

针对越来越明显的大功率电子元器件的散热问题,主要综述了目前氮化硅陶瓷作为散热基板材料的研究进展.对影响氮化硅陶瓷热导率的因素、制备高热导率氮化硅陶瓷的方法、烧结助剂的选择、以及氮化硅陶瓷机械性能和介电性能等方面的最新研究进展作了详细论述,最后总结了高热导率氮化硅作为散热基板材料的发展趋势.%In view of the heat dissipation of high-power electronic devices, the research progress of silicon nitride ceramics as a heat sink material is reviewed. Then the effect of the main factors on the thermal conductivity, the preparation method, the sintering additives during sintering process, and the mechanical and dielectric properties of silicon nitride ceramics are detailedly discussed. Finally, the future prospect of silicon nitride ceramics as heat dissipation substrate material is predicted.