封装材料对单触发开关的性能影响研究❋

摘要

For the requirements of one-shot switch which have high turn-on current and high conductivity rate, based on the production of Schottky diodes, the switch have been fabricated by three different packaging materials including epoxy resin, silicone and HTPB rubber. In the experiments, the peak current, delay time and rise time of switch were analyzed. Results show that the peak current of epoxy resin is the highest and that of silicon is lowest. Delay time is the shortest when the packing material is epoxy resin which could completely bound the arc of electrical explosion of SBD. The packing mate-rial has no significant effect on the rise time of the switch.%针对单触发开关高导通电流和高导通速率的要求,本文在制备肖特基二极管(SBD)单触发开关的基础上,采用环氧类树脂胶、有机硅胶以及端羟基聚丁二烯(HTPB)橡胶3种不同类型的材料封装单触发开关,分析比较其对开关峰值电流、延迟时间和上升时间的影响。试验结果表明,对于3种封装材料,单触发开关的峰值电流大小的顺序为：AB 胶> HTPB 橡胶>704胶；同时,AB 胶封装的开关延迟时间最短,分析原因是其能够约束住肖特基二极管电爆炸产生的电弧。封装材料对开关的上升时间没有显著影响。