基于超声扫描显微镜的金属封装检测研究

摘要

This paper invents the M etal Package on the foundation of echo scanning based on the Scanning A coustic M icroscope.It show s that the Scanning A coustic M icroscope. C an not only identifies and locates the defect,butalso precisely m easures the defectsize.%　　基于超声扫描显微镜，对金属封装的声学特性进行分析，结果表明，超声扫描显微镜可实现对金属封装焊缝缺陷的定性、定位、定量检测。