超声扫描显微镜检查在倒装器件检测中的应用

摘要

随着倒装器件在型号产品中使用越来越广泛，倒装器件在使用过程中也暴露出一些问题，如底充胶分层、焊点空洞以及裂纹等，这些缺陷均能导致倒装器件失效。总结了几种倒装器件超声扫描的缺陷，重点对底充胶以及焊点进行分析。同时，论述了倒装器件超声检测中内部界面缺陷的辨别以及原理。%With the widespread use of the lfip-chip devices in production, the lfip-chip device in using also exposed some problems. For example, the lfip-chip device has delamination in underifll and voids or cracks in solder bumps, etc. All of those defects could cause the lfip-chip device failure. The paper collected the some SAM defects of lfip-chip devices and focused discussion on underifll and bumps. At the same time, this paper discussed discrimination and principle, etc.