激光加工中切割PZT 陶瓷的控制改进

摘要

Be aim to the new requirement of the consumers about Laser Machining PZT ceramic without any block on the surface of sapphire wafer,this article discuss and achieve the function about the new scheduling. This function has changed the single machining mode and expanded the application of laser machining equipment.%介绍在原有激光加工切割PZT陶瓷的工艺过程中，加入机械工装夹具后，软件部分进行的控制改进，并通过生产现场的测试数据来对技术升级进行验证，效果良好，并得到了客户的一致好评。