废弃电路板预分离焊锡处理技术研究

摘要

针对废弃电路板金属回收处理工艺的优化研究，基于环境工程专业视角，提出处理废弃电路板之前预分离焊锡金属的方法，通过使用数控气氛炉等装置进行多次实验，确定控制加热温度250℃、加热时间5 min可以实现预分离焊锡金属的最佳状态，从而减少后续提取其他金属的技术复杂度，提高金属综合回收效率，有助于工业化处理废弃电路板，实现资源循环利用。%The optimal research on the technology of recovering metals from waste printed circuit boards was done. The method of pre-separating the solder was suggested.Many tests were done using different devices such as CNC atmosphere furnace to look for the most optimal condition of solder separation.The 250℃ of heating temperature and 5 minutes of heating time could realize the pre-separation of solder from the waste circuit boards.This pre-treatment could decrease the difficulty of separating other metals on the boards and increase the recovery rates of metals.