LEAD-FREE SOLDER PASTE FOR PRECOAT AND FLUX FOR USE IN LEAD-FREE SOLDER PASTE FOR PRECOAT

摘要

PPROBLEM TO BE SOLVED: To provide lead-free solder paste for a precoat with which an electrode face can be smoothly and thinly precoated. PSOLUTION: The lead free-solder paste for a precoat contains: 60-85 wt.% of Sn based lead-free solder (a) containing the powder with a particle diameter of ≤20 μm in the range of ≥90 wt.%; and bromine based compound-containing flux (b) in the range of 15 to 40 wt.%. PCOPYRIGHT: (C)2007,JPO&INPIT