接插件微孔深孔电镀工艺技术

摘要

揭示了通信用高可靠电连接器微型化趋势及其对微小深孔和间隙电镀的需要，分析了镀件黑孔等镀层不良的原因，提出并验证了改善的措施，如采用超声波清洗，预镀半光亮铜，镀低应力镍，使用脉冲电镀等。系统论述了在微孔深孔电镀工艺技术方面的创新。采用超声波加振动的电镀方式，可以提高镀液的均镀能力和深镀能力，有效解决了黑孔问题。%The miniaturization tendency of highly reliable connectors for communication and the need of electroplating in deep micro-holes and gaps were revealed. The causes of black hole and other coating defects were analyzed. Some improvement measures were presented and validated. The black hole problem can be solved by vibratory electroplating with the assistance of ultrasound, due to the improvement of throwing and covering power of the bath.