表面贴装集成电路引脚整形研究

摘要

With the rapid development of microelectronics technology, electronic devices and electronic products are becoming more and more miniaturized. Currently, surface mount integrated circuit(SMIC) has become a mainstream form of encapsulation, such packaged integrated circuit are highly integrated with multi-pins and ifne pitch. This encapsulation form meet the miniaturization development needs for users, but it also brings a lot of problems, such as lead coplanarity issue. In consideration of the problem of coplanarity, there is a study for reforming the pins of SMIC with the purpose of improving the reliability of solderability is needed.%微电子技术的迅猛发展，促进了电子器件和电子产品小型化的发展。目前，表面贴装集成电路（SMIC）已成为主流封装形式，此类封装集成电路具有集成度高、管脚多、间距小等特点，在生产上满足了向小型化发展的需求，但是也带来了很多问题，其中引脚共面性问题为常见的问题之一。结合SMIC在使用过程中因引脚共面性引起的焊接问题，对SMIC的引脚整形试验展开研究。