对基于BCB的圆片级封装工艺进行了研究,该工艺代表了MEMS加速度计传感器封装的发展趋势,是MEMS加速度计产业化的关键。选用3000系列BCB材料进行MENS传感器的粘结键合工艺试验,解决了圆片级封装问题,在低温250℃和适当压力辅助下≤2.5bar(1bar=100kPa)实现了加速度计的圆片级封装,并对相关的旋涂、键合、气氛、压力等诸多工艺参数进行了优化。%The wafer-level adhesive bonding based on BCB is studied. It is the packaging trend for the MEM5 accelerometer and is essential to the industrialization of the MEMS accelerometer. A novel MEMS wafer level packa-ging method is achieved by the BCB bonding technique with the BCB 3000 as a bonding material. The wafer level packaging at low temperature (250℃) and proper pressure( ≤2. 5 bar) is realized. The related process parameters of spin coating, bonding, atmosphere, and bonding pressure and etc. are optimized.
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