关于CCD铝布线光刻工艺质量的优化研究

摘要

针对CCD器件制作过程中铝布线的光刻工艺质量较差问题,阐述了其产生的原因和对后续刻蚀工艺造成的影响及对器件性能造成的不良结果.文中从改进光刻工艺参数的角度入手进行试验查找相应的解决办法,通过为高台阶层次添加焦距补偿的方法提高铝布线的光刻工艺质量.通过器件性能测试验证了其可行性,在之后制定了工艺规范,使器件整体的工艺能力和成品率得到显著提升.%The reasons for the poor quality of the aluminum wiring in the CCD device fabrication process are elaborated, and the effect of the subsequent etching process and the bad results of the device performance are described.Corresponding solutions are found from the test of lithography process parameters.The quality of the aluminum wiring is improved by adding the focal length for the high level steps.After the validation of the feasibility of the device performance, the process specification is established, and the device process capability and yield are significantly improved.