键合线故障下IGBT的电磁干扰特性研究

摘要

IGBT module of power electronic devices exist many fault types, and bonding wire off fault is the most common one, how to determine the occurrence of IGBT bonding wire off fault has become a research difficulty. By analyzing the mechanism of bonding wires off and the effect of IGBT switching process when a fault occurs, shows that bonding wire failure will cause the electromagnetic interference becomes large during the IGBT module working process, and has been verified by experiment. The result show that it is feasible to diagnose IGBT module has a bonding wire off fault by monitoring the intensity of electromagnetic interference of the circuit, and it has some practical engineering.%电力电子装置中的IGBT模块存在多种故障类型，键合线脱落故障是其中最常见的一种，如何判定IGBT发生键合线脱落故障成为一个研究难点。通过分析键合线的脱落机理和发生故障时对IGBT开关过程的影响，可以得出键合线故障会导致IGBT模块工作过程中产生的电磁干扰变大，然后通过实验进行验证。结果表明，通过监测回路中电磁干扰强度来诊断IGBT模块发生键合线脱落故障是可行的，且具有一定的工程实际意义。