一种可靠的功率器件绝缘与热传导路径设计

摘要

By testing the Case and the heat sink temperature of the same IGBT under the same conditions in the shells of different sizes of copper,thermal resistance of each conductive path is calculated to analyse the relationship between thermal resistance and the contact surface size. The size of the copper block power devices required for the safe temperature range is calculated according to this relationship,the feasibility of this conclusion is verified by FLOTHERM.a professional thermal simulation software. Finally,the temperature of power devices is measured, which is basically in line with the simulation.%通过测试相同工作条件下同一IGBT在不同大小的铜块下的管壳和散热片的温度,计算每次传导路径中的热阻,分析热阻和接触面大小的关系.根据这一关系推算出功率器件在安全的温度范围内工作所需要的铜块大小,利用FLOTHERM专业热仿真软件验证这个结论的可行性；实测了实验条件下的功率器件的温度,仿真结果与实验结果基本符合.