金刚石表面扩散镀钨的研究

摘要

In the preparation of diamond copper composite material by pressureless infiltration,in order to reduce the wetting angle between copper and diamond,diffusion plated tungsten on the diamond surface were studied.The effect of reactant proportion,vacuum degree and plating temperature on the plating were instituted.The component and microstructure of the plating were characterized by XRD and SEM.The results indicated that,with reaction temperature 950–1050 ℃,vacuum about 10 Pa,m (diamond)to m(W+WO3)1∶1 or 1∶1.5,a 100–300 nm uniform coating was plated on diamond surface with no leakage.In addition,there are transition layer generated between tungsten layer and diamond.%在无压熔渗法制备金刚石铜复合材料过程中，为了减小铜与金刚石之间的润湿角，对金刚石表面进行了扩散镀钨处理，并分别对反应物比例、反应过程真空度、镀覆温度对镀层的影响进行了研究。用 X射线衍射分析方法测定了镀层成分，用扫描电子显微镜观察了镀层表面结构。实验结果表明：温度为950~1050℃、真空度为10 Pa、金刚石与初混料(钨与三氧化钨的混合料记作初混料，下同)质量比为1∶1或1∶1.5时，金刚石表面获得100~300 nm 的均匀的镀层，没有漏镀现象，且钨层与金刚石之间有碳化钨层生成。