高温超导带材Bi-2223/Ag的焊接接头电阻研究

摘要

针对高温超导带材Bi-2223/Ag的焊接问题进行了研究.利用ANSYS建立焊接接头电阻特性的有限元计算模型,仿真和计算分析了焊料材料、搭接长度和焊锡层厚度对接头电阻值的影响,并进行了实验验证.实验表明:可通过减少焊料厚度,增加焊接搭接长度来减少接头电阻,当焊接长度在2～5cm,焊料厚度为0.5mm时,Bi-2223/Ag带材间的接头电阻在液氮温度下可以控制在10(-7)～10(-8)之间,可以满足超导装置稳定运行的要求.%This paper made systematical studies on the joint of Bi -2223/Ag HTS tape. The FEM simulation model of joint resistance property was established by ANSYS. It was used to simulate, analyse the effect of solder material, contact lenth and solder layer thickness on joint resistance. Experiment results showed that joint resistance could be reduced by decreasing the solder thickness and increasing the contact length. When the contact length was 2 ～ 5cm and the solder thicknees was 0. 5mm, the joint resistance of Bi -2223/Ag HTS tapes at liquid nitrogen temperature could be controlled within the range of 10-7 ～ 10-8Ω,which could meet the requires of stable operation of superconducting devices.