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Phase stability and grain growth in an Ag/Bi-2223 composite conductor prepared using fine-grained Bi-2223 as a precursor.

机译:使用细粒Bi-2223作为前体制备的ag / Bi-2223复合导体中的相稳定性和晶粒生长。

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We have investigated the stability and microstructural transformability of the Bi-2223 phase in a silver-sheathed monofilament composite tape fabricated using fine-grained Bi(sub 1.7)Pb(sub 0.3)Sr(sub 1.9)Ca(sub 2.0)-Cu(sub 3.0)O(sub y) (Bi-2223) as the precursor powder. The fully formed Bi-2223 precursor was prepared using established procedures. The purpose of this study was to explore the prospects for growing textured, large-grain-size Bi-2223 from the fine-grained precursor by process parameter perturbations. These perturbations included thermal ramp up variations, programmed heat treatment temperature and oxygen pressure fluctuations, and parameter manipulations during cool-down. Our results show that the types of heat treatments used in conventional oxide-powder-in-tube (OPIT) processing do not facilitate Bi-2223 grain growth when the precursor powder is preconcerted Bi-2223. We also observed that the Bi-2223 partially decomposed during conventional thermal ramp-up in 0.075 atm O(sub 2), but that this decomposition can be inhibited by ramping up in a reduced oxygen pressure. A pathway was found for back-reacting the fine-grained Bi-2223 (to Bi-2212, Bi-2201 and nonsuperconducting secondary phases), then reforming large-grained Bi-2223 in a colony microstructure having some distinct differences from that produced during conventional OPIT processing.

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