IA-64平台可扩展固件接口设计与开发

摘要

Intel IA-64 architecture adopts a brand new firmware model, it is classified in three levels :the processor abstract level (PAL),the system abstract level (SAL) and the extensible firmware interface (EFI).This paper introduces the architecture of extensible firmware interface on IA-64 platform and the methods to implement it on targeted platform.It describes EFI1 10 14-62, the Intel' s sample implementation of EFI, as well as the main works for porting it to targeted platform and the usual steps of debugging means.%Intel IA-64体系结构采用了全新的固件模型,它分为三个不同的层次:处理器抽象层(PAL)、系统抽象层(SAL)、可扩展固件接口(EFI).介绍IA-64平台可扩展固件接口的基本结构和在目标平台上的实现方法.详细描述Intel的可扩展固件接口实现EFI1_10_14_62,以及把它移植到目标平台时要进行的主要工作和通常所采用的调试手段.