采用电子束蒸发技术在AlN衬底上蒸镀Ti/Ni双层金属化薄膜,通过SEM、EDS和AES等方法分析抛光AlN表面状态及与金属化薄膜间的相互作用.结果表明:离子束清洗可去除AlN衬底表面疏松层,改变AlN衬底表面状态,提高衬底表面能.结合热蒸发原子的作用,膜基界面处Al、N和Ti元素之间产生相互扩散现象,AlN陶瓷和Ti膜的附着机制由未清洗前的简单附着改变为扩散附着,极大提高了金属化薄膜粘结性能,其拉脱强度达300 MPa以上,且无需后续退火处理.%Metallized thin films of Ti and Ni on AlN substrate were deposited by E-beam evaporation. AlN ceramic surface state and interaction with metallized thin films were investigated by SEM, EDS and AES. The results indicate that a loosened layer of AlN substrate surface is wiped off by ion beam sputter-cleaning, which can change the state of AlN ceramic surface, and then increase the surface energy. Because of the increasing surface energy and the influence of hot evaporation atoms, the spread among Al, N and Ti exists at the interface, and the adherence mechanism for Ti film and AlN is changed from simple adhesion to spread adhesion during ion beam sputter-cleaning. Thus, the adhesion strength of metallized thin films is improved greatly. So the sample shows a high adhesion strength over 300 MPa and needs no anneal treatment.
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