To deal with the increasing metal layers in the front side of integrated circuit,the backside single event effects laser testing method based on the experimental resultsof the unhardened SRAM IL-2 and the hardened SRAM 1020-2 was presented. Theproblems that involved backside laser testing were discussed. The hardened validity wasobtained by comparing the effective energy threshold between both samples.%为避免集成电路正面金属层对激光的阻挡,采用背面照射的方法对非加固SRAM IL-2和加固SRAM 1020-2进行了单粒子效应实验.对脉冲激光背面照射实验的相关问题进行了探讨.比较了两种器件产生单个位翻转的有效激光阈值能量,验证了器件加固措施的有效性.
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