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Effect of defects on the electrical/optical performance of gallium nitride based junction devices.

机译:缺陷对基于氮化镓的结器件的电气/光学性能的影响。

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Commercial GaN based electronic and optoelectronic devices possess a high density (107-109 cm-2) of threading dislocations (TDs) because of the large mismatch in the lattice constant and the thermal expansion coefficient between the epitaxial layer structure and the substrate. In spite of these dislocations, high brightness light emitting diodes (LEDs) utilizing InGaN or AlGaN multiple quantum wells (MQWs) and with an external quantum efficiency of more than 40%, have already been achieved.;This high external quantum efficiency in the presence of a high density of dislocations has been explained by carrier localization induced by indium fluctuations in the quantum well. TDs have been found to increase the reverse leakage current in InGaN based LEDs and to shorten the operating lifetime of InGaN MQW/GaN/AlGaN laser diodes. Thus it is important that the TD density is further reduced. It remains unclear how the TDs interact with the device to cause the effects mentioned above, hence the careful and precise characterization of threading defects and their effects on the electrical and optical performances of InGaN/GaN MQW LEDs is needed. This investigation will be useful not only from the point of view of device optimization but also to develop a clear understanding of the physical processes associated with TDs and especially with their effect on leakage current.;We have employed photoelectrochemical (PEC) etching to accurately measure the dislocation density initially in home-grown GaN-based epitaxial structures and recently in InGaN/GaN MQW LEDs fabricated from commercial grade epitaxial structures that were supplied by our industrial collaborators. Measuring the electrical and electroluminescence (EL) characteristics of these devices has revealed correlations between some aspects of the LED behavior and the TD density, and promises to allow a deeper understanding of the role of threading dislocations to be elucidated.;We observed that the LED reverse leakage current increased exponentially, and electroluminescence intensity decreased by 22%, as the TD density in the LEDs increased from 1.7 x 107 cm-2 to 2 x 108 cm-2. Forward voltage remained almost constant with the increase of TD density. A model of carrier conduction via hopping through defect related states, was found to provide an excellent fit to the experimental I-V data and provides a useful basis for understanding carrier conduction in the presence of TDs.
机译:商业化的基于GaN的电子和光电器件具有高密度(107-109 cm-2)的螺纹位错(TD),因为晶格常数和外延层结构与衬底之间的热膨胀系数存在很大的不匹配。尽管存在这些位错,但已经实现了利用InGaN或AlGaN多量子阱(MQW)并具有超过40%的外部量子效率的高亮度发光二极管(LED);高位错密度的解释是由量子阱中铟涨落引起的载流子局部化所解释的。已经发现TD会增加基于InGaN的LED中的反向漏电流并缩短InGaN MQW / GaN / AlGaN激光二极管的工作寿命。因此,重要的是进一步降低TD密度。尚不清楚TD如何与器件相互作用以产生上述效应,因此需要仔细,精确地表征穿线缺陷及其对InGaN / GaN MQW LED的电学和光学性能的影响。这项研究不仅会从器件优化的角度出发,而且有助于深入了解与TD相关的物理过程,尤其是它们对漏电流的影响。;我们已采用光电化学(PEC)蚀刻来精确测量位错密度最初出现在自产的基于GaN的外延结构中,最近出现在由我们的工业合作伙伴提供的由商业级外延结构制成的InGaN / GaN MQW LED中。测量这些设备的电和电致发光(EL)特性已经揭示了LED行为和TD密度的某些方面之间的相关性,并有望使人们更深入地了解螺纹位错的作用。随着LED的TD密度从1.7 x 107 cm-2增加到2 x 108 cm-2,反向泄漏电流呈指数增加,电致发光强度降低22%。随着TD密度的增加,正向电压几乎保持恒定。发现了通过跳越缺陷相关状态的载流子传导模型,可以很好地拟合实验I-V数据,并为理解存在TD时的载流子传导提供了有用的基础。

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