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Study of inversion capacitances and drive currents for MOSFETs made of high-mobility semiconductors.

机译:研究由高迁移率半导体制成的MOSFET的反向电容和驱动电流。

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摘要

Over the past 50 years, silicon-based MOSFETs have been scaled according to Moore's Law. Traditional methods of scaling involved reduction of channel length and gate oxide thickness. In recent years, as silicon MOSFETs decreased in size to the nanoscale regime, new scaling methods such as hybrid orientation and strain engineering were introduced. But even these methods may not be sufficient to deliver the increased switching speed needed in future MOSFETs. High-mobility channel materials are being considered as a promising alternative to silicon.;In this work, the four high-mobility channel materials studied are germanium (Ge), gallium arsenide (GaAs), indium gallium arsenide (InGaAs), and indium arsenide (InAs). The two material-specific components of the drive current equation, mobility and inversion capacitance (Cinv), are used to evaluate the improvement in drive current achieved from use of high-mobility channel materials. In the past, drive current was assumed proportional to mobility but, in fact, the effect of quantum confinement on the Cinv value changes this relationship. This study has found that, for a gate dielectric of EOT≤1 nm, the advantages of higher mobilities for the aforementioned semiconductors are substantially downgraded due to their lower values. Quantum confinement of inversion carriers occurs in all MOSFETs biased into inversion. But, as MOSFETs are reduced in size and gate oxides become very thin, the quantum confinement effect becomes more noticeable in determining Cinv.;Quantum confinement shifts the centroid of the inversion charge away from the oxide-semiconductor interface, which reduces the Cinv value. Therefore, in order to determine an accurate Cinv value for high-mobility channel materials, a CV simulator incorporating quantum confinement effects was used in this study. The simulation of carrier concentration distributions shows that the amount by which the inversion charge is shifted is determined by the density of states of the material. For materials with lower density of states, the centroid of charge was shifted further from the interface and found to correspond to lower Cinv.;Once Cinv values were obtained, an Id ratio was calculated by taking the product of Cinv and mobility for the high-mobility channel material and dividing it by the same product for silicon. This investigation has found that high-mobility channel materials are indeed a promising alternative to silicon in delivering higher drive current in nMOSFETs, although the current gain is much less than the mobility gain for each semiconductor studied. For the InAs nMOS device, the Id was 8-9x higher than in Si. InGaAs, GaAs, and Ge had Id ratios of ∼4.5, ∼3.5 and ∼2.5, respectively. For pMOSFETs, the advantage of using high-mobility channel materials is much less pronounced. The one exception was Ge, which due to its high hole mobility, had an Id ratio of about 4. The study also revealed that for ultra-short channel nMOSFETs, where channel length is close to electron mean free path, the ballistic transport of electrons diminishes the advantage of using high-mobility channel materials over silicon.
机译:在过去的50年中,根据摩尔定律对硅基MOSFET进行了缩放。传统的缩放方法涉及减小沟道长度和栅极氧化物厚度。近年来,随着硅MOSFET尺寸减小到纳米尺度,引入了新的缩放方法,例如混合取向和应变工程。但是,即使这些方法也可能不足以提供未来MOSFET需要的增加的开关速度。高迁移率通道材料被认为是硅的有前途的替代品;在这项工作中,研究的四种高迁移率通道材料是锗(Ge),砷化镓(GaAs),砷化铟镓(InGaAs)和砷化铟(InAs)。驱动电流方程中的两个特定于材料的成分,迁移率和反向电容(Cinv),用于评估使用高迁移率沟道材料实现的驱动电流的改善。过去,假设驱动电流与迁移率成正比,但实际上,量子约束对Cinv值的影响改变了这种关系。这项研究发现,对于EOT≤1 nm的栅极电介质,上述半导体的较高迁移率的优势由于其较低的值而大大降低。反向载流子的量子约束发生在所有偏置为反向的MOSFET中。但是,随着MOSFET尺寸的减小和栅极氧化物变得非常薄,确定Cinv的量子限制效应变得更加明显。量子限制将反转电荷的质心从氧化物-半导体界面移开,从而降低了Cinv值。因此,为了确定高迁移率通道材料的准确Cinv值,本研究中使用了包含量子约束效应的CV​​仿真器。载流子浓度分布的模拟表明,反转电荷的移动量取决于材料状态的密度。对于状态密度较低的材料,电荷的质心从界面上进一步移开,并发现其对应于较低的Cinv。一旦获得Cinv值,则通过取Cinv与迁移率的乘积来计算Id比,迁移率通道材料,并将其除以相同的硅产品。这项研究发现,在nMOSFET中提供更高的驱动电流时,高迁移率沟道材料确实是硅的有前途的替代品,尽管电流增益远小于所研究的每种半导体的迁移率增益。对于InAs nMOS器件,Id比Si高8-9倍。 InGaAs,GaAs和Ge的Id比率分别为〜4.5,〜3.5和〜2.5。对于pMOSFET,使用高迁移率沟道材料的优势就不那么明显了。 Ge是一个例外,由于其高的空穴迁移率,其Id比率约为4。该研究还表明,对于沟道长度接近电子平均自由程的超短沟道nMOSFET,电子的弹道传输削弱了使用高迁移率沟道材料而不是硅的优势。

著录项

  • 作者

    Lubow, Abigail.;

  • 作者单位

    Yale University.;

  • 授予单位 Yale University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2009
  • 页码 92 p.
  • 总页数 92
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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