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Design, fabrication and modeling of vacuum microelectronics devices.

机译:真空微电子器件的设计,制造和建模。

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摘要

Vacuum microelectronic devices involve field emission of electrons in a vacuum with solid-state integrated circuits fabrication technology. For the past three years, the outstanding features of these new devices have attracted scientist's attention world wide.;The first step of our work is the design of diode and triode arrays. Both arrays are designed by using a "Building Block" method to simplify the fabrication procedures and reduce the number of masks. The "Building Block" method was developed in our Integrated Microelectronics Laboratory at the University of Kentucky. The advantage of this method is that it yields a very simple assembly process; the disadvantage of this method is that it requires high alignment precision for placing the grid plate for the triode array.;The second step of this work is the fabrication of the vacuum microelectronic diode. We use an anisotropic etching technique in silicon processing and micromachining to construct the building blocks. All fabrication procedures are based on advanced integrated circuit processing techniques including silicon wafer oxidation, photoresist coating, photoresist exposure and developing, oxide window etching and, finally, a silicon micromachining technique to construct the miniature structure on the silicon wafer.;The last step of our experiment is the device modeling of our physical structure. By solving Laplace's Equation with simplified boundary conditions we obtain an expression for the electric field intensity at the surface of the silicon emitter tip. We use the Fowler-Nordheim Equation and the resulting electric field intensity calculated above to model the experimental I-V curve of our diode. We were unable to fabricate the proposed triode structure, but we created a triode model for calculating the triode's I-V characteristics.;Combining the results of this calculation with the dimensions of a Russian triode reported by V. I. Makhov, we found our calculated triode I-V curves to compare favorably with the experimental plots from the Russian's work.
机译:真空微电子器件涉及利用固态集成电路制造技术在真空中电子的场发射。在过去的三年中,这些新设备的出色功能引起了全世界科学家的关注。;我们工作的第一步是二极管和三极管阵列的设计。通过使用“构件块”方法来设计两个阵列,以简化制造过程并减少掩模的数量。 “构建模块”方法是在肯塔基大学的集成微电子实验室开发的。这种方法的优点是产生非常简单的组装过程。该方法的缺点在于,其需要高的对准精度来放置用于三极管阵列的栅格板。这项工作的第二步是真空微电子二极管的制造。我们在硅加工和微机械加工中使用各向异性蚀刻技术来构造构件。所有制造过程均基于先进的集成电路处理技术,包括硅晶片氧化,光致抗蚀剂涂层,光致抗蚀剂曝光和显影,氧化物窗口蚀刻以及最后的硅微加工技术,以在硅晶片上构建微型结构。我们的实验是对我们的物理结构进行设备建模。通过用简化的边界条件求解拉普拉斯方程,我们得到了硅发射极尖端表面电场强度的表达式。我们使用Fowler-Nordheim方程和上面计算出的所得电场强度来为二极管的实验I-V曲线建模。我们无法制造出建议的三极管结构,但创建了一个用于计算三极管IV特性的三极管模型;将该计算结果与VI Makhov报告的俄罗斯三极管的尺寸相结合,我们发现计算出的三极管IV曲线为与俄罗斯人的实验性地块相比可谓优胜劣汰。

著录项

  • 作者

    Liang, Weimin.;

  • 作者单位

    University of Kentucky.;

  • 授予单位 University of Kentucky.;
  • 学科 Engineering Electronics and Electrical.;Physics Electricity and Magnetism.;Physics Condensed Matter.
  • 学位 Ph.D.
  • 年度 1991
  • 页码 291 p.
  • 总页数 291
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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