首页> 外文学位 >Fast evaluation of VLSI interconnect structures using moment-matching methods.
【24h】

Fast evaluation of VLSI interconnect structures using moment-matching methods.

机译:使用力矩匹配方法快速评估VLSI互连结构。

获取原文
获取原文并翻译 | 示例

摘要

For high performance digital circuits and systems, physical interconnect is rapidly becoming a dominant factor on overall performance. It is essential, therefore, that accurate models and evaluation techniques be developed to account for interconnect effects during design verification. The dominance of interconnect is particularly evident in systems incorporating multiple levels of integration, such as multi-chip module (MCM) systems. For an accurate interconnect evaluation of such a system, all the non-idealities associated with distributed interconnects must be considered, using models valid over the full bandwidth of high speed digital signals. Crosstalk, slow-wave propagation, and skin-effect are some of the potential non-idealities that must be dealt with. Such effects, in addition to presenting significant modeling challenges, are difficult to handle with typical digital-system verification tools.;This thesis discusses the design of accurate lumped-circuit models for non-ideal interconnects. The physical behavior of the various classes of distributed interconnect structures is considered in the design of the lumped approximations. Evaluation of the lumped models is efficiently achieved using the moment-matching method of Asymptotic Waveform Evaluation (AWE). Methods to ensure the reliability and accuracy of the AWE technique, in the context of interconnect evaluation, are described. In addition, efficient methodologies based on the proposed algorithms, for timing evaluation at the system level, are presented. Extensions to consider the effects of nonlinear driver and load models are also suggested. These address critical concerns in the design verification and test of the high-speed, high-performance systems of the future.
机译:对于高性能数字电路和系统,物理互连正迅速成为总体性能的主要因素。因此,开发精确的模型和评估技术以解决设计验证过程中的互连效应至关重要。在包含多个集成级别的系统(例如多芯片模块(MCM)系统)中,互连的优势尤为明显。为了对这样的系统进行准确的互连评估,必须使用在高速数字信号的整个带宽上有效的模型,考虑与分布式互连相关的所有非理想性。串扰,慢波传播和集肤效应是必须解决的一些潜在的非理想因素。除了提出重大的建模挑战之外,这种影响还很难用典型的数字系统验证工具来处理。;本文讨论了用于非理想互连的精确集总电路模型的设计。在集总近似的设计中考虑了各种类型的分布式互连结构的物理行为。使用渐近波形评估(AWE)的矩匹配方法可以有效地实现集总模型的评估。描述了在互连评估的背景下确保AWE技术的可靠性和准确性的方法。另外,提出了基于所提出算法的有效方法,用于系统级的时序评估。还建议扩展考虑非线性驱动器和负载模型的影响。这些解决了未来高速,高​​性能系统的设计验证和测试中的关键问题。

著录项

  • 作者

    Gopal, Nanda.;

  • 作者单位

    The University of Texas at Austin.;

  • 授予单位 The University of Texas at Austin.;
  • 学科 Electrical engineering.
  • 学位 Ph.D.
  • 年度 1992
  • 页码 163 p.
  • 总页数 163
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号