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Silicon metal-semiconductor-metal photodetectors: Ion-implanted high-speed near-infrared photodiodes and position-sensitive photodetectors.

机译:硅金属半导体金属光电探测器:离子注入高速近红外光电二极管和位置敏感型光电探测器。

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摘要

Silicon metal-semiconductor-metal (MSM) photodetectors were studied for two applications: high-speed photodetection at near-infrared wavelengths (700-1000 nm) and high-resolution position detection. In the high-speed photodetection application, the long absorption length ({dollar}sim{dollar}5-20 {dollar}mu{dollar}m) inherent in silicon at these wavelengths result in an unacceptable diffusion tail in the impulse response of the photodetectors. Introducing a damaged layer {dollar}sim{dollar}1 {dollar}mu{dollar}m below the Si surface by a simple ion-implantation step reduced the diffusion tail while maintaining the higher mobility crystalline region above for carrier transport and making the Ni Schottky contacts. Two types of implant damage were studied: divacancies (from F-ion implantation) and nanovoids (from He-ion implantation followed by a high-temperature anneal). For both types of implantation damage, the bandwidth of the device at 980 nm increased from {dollar}<{dollar}1 GHz to more than 3 GHz for the nanovoid detectors and 9 GHz for the F-implanted detectors, with only a modest loss in quantum efficiency in the nanovoid detectors. While an increase in the absorption coefficient was measured for both types of implant damage, this did not translate into a higher signal in the actual devices because of the large number of recombination centers present in the implanted material. The ultimate effect of implantation was reduction in the diffusion tail (increase in speed) rather than both a higher signal and faster speed.; In the second application, the photocurrent from crystalline Si MSM photodiodes was monitored as a function of the laser beam position inside the photodetector's active area. One-dimensional (1-D) and two-dimensional (2-D) sensors were fabricated and position sensitivity was tested at different laser wavelengths, powers and laser spot diameters. A position resolution of 4 nm was achieved, limited by mechanical vibrations. The position resolution predicted from the electronic noise limit is 25 pm/{dollar}surd{dollar}Hz. A model for the position-sensitive signal incorporating surface recombination, diffusion and laser spot diameter was developed using a Green function technique.
机译:研究了硅金属-半导体-金属(MSM)光电探测器的两种应用:近红外波长(700-1000 nm)的高速光电探测和高分辨率位置探测。在高速光检测应用中,在这些波长下,硅固有的长吸收长度(dollar} sim {dollar} 5-20 {dollar}μm{dollar} m会导致其脉冲响应中不可接受的扩散尾巴。光电探测器。通过简单的离子注入步骤在硅表面下方引入一个损坏的层{dollar} sim {dollar} 1 {dollar}μm{dollar} m,减少了扩散尾,同时保持了较高的迁移率结晶区,以进行载流子传输并形成了Ni肖特基触点。研究了两种类型的植入物损坏:空位(来自F离子植入)和纳米空隙(来自He离子植入,然后进行高温退火)。对于两种类型的植入损伤,纳米空隙探测器的980 nm带宽从{dollar} <{dollar} 1 GHz增大到3 GHz以上,F注入探测器的带宽从9 GHz增大到9 GHz。在纳米空隙探测器中的量子效率。尽管针对两种植入物损坏都测量了吸收系数的增加,但由于植入材料中存在大量的重组中心,因此在实际设备中并未转化为更高的信号。植入的最终效果是减少了扩散尾部(提高了速度),而不是同时获得了更高的信号和更快的速度。在第二个应用中,根据晶体在光电探测器的有效区域内的激光束位置,对来自晶体硅MSM光电二极管的光电流进行监控。制造一维(1-D)和二维(2-D)传感器,并在不同的激光波长,功率和激光光斑直径下测试位置灵敏度。受到机械振动的限制,获得了4 nm的位置分辨率。根据电子噪声限制预测的位置分辨率为25 pm / {dollar} surd {dollar} Hz。使用格林函数技术开发了一种结合了表面重组,扩散和激光光斑直径的位置敏感信号模型。

著录项

  • 作者单位

    The University of New Mexico.;

  • 授予单位 The University of New Mexico.;
  • 学科 Physics Optics.; Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 1997
  • 页码 133 p.
  • 总页数 133
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 光学;无线电电子学、电信技术;
  • 关键词

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