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Chemical vapor deposition and characterization of zirconium tin titanate as a high dielectric constant material for potential electronic applications.

机译:钛酸锆锡的化学气相沉积和表征,作为潜在电子应用的高介电常数材料。

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Integrated circuit (IC) manufacturers increasingly need new high dielectric constant (ϵ) materials for gate stacks to maintain the pace of developing faster, higher capacity CMOS and DRAM devices. Identification of new high-ϵ materials that can be integrated into current manufacturing processes is critical to the continued development of IC devices. Using magnetron sputtering and a compositional spread approach, a key composition of amorphous zirconium tin titanate (a-ZTT) films was found to exhibit a dielectric constant from 50 to 70 and leakage currents from 10−9 to 10 −7 A/cm2 at 1 MV/cm. Chemical Vapor Deposition (CVD) is an attractive technique for deposition of ZTT films because it offers several advantages over sputter deposition. Many processing parameters can be controlled and varied in the optimization of the film microstructure and composition. In addition, high-ϵ phases of the compounds might be achieved at low temperatures by using plasma enhancement of the CVD process. Alternatively, use of ozone or other oxidants may allow complete oxidation of metal precursors at lower processing temperatures.; The following discussion details the construction and modification of a CVD reactor for the deposition of ZTT thin films. In addition, characterization of a precursor “cocktail”—a solution containing all the metal components of the film—for the deposition of ZTT thin films is discussed.{09}Discussion includes experiments characterizing the dielectric and device properties (dielectric constant, dielectric loss, capacitance, and leakage current) of CVD-grown, a-ZTT thin films using the precursor “cocktail”. The importance of the relationship of the cation ratio in the precursor that is translated to the film and its relationship to the dielectric properties are shown. The device properties of ZTT films were measured using Capacitance-Voltage (CV) and Current-Voltage (IV) analysis, while dielectric properties were explored using Impedance Spectroscopy (IS), and Spectroscopic Ellipsometry (SE). In addition, X-ray Photoelectron Spectroscopy (XPS), Rutherford Backscattering (RBS), and High Resolution Transmission Electron Microscopy (HRTEM), were used to correlate compositional characteristics and investigate certain morphological characteristics.
机译:集成电路(IC)制造商越来越需要用于栅极叠层的新型高介电常数(&epsiv)材料,以保持开发速度更快,容量更大的CMOS和DRAM器件的步伐。鉴定新的高败血症;可以集成到当前制造工艺中的材料对于IC器件的持续开发至关重要。使用磁控溅射和成分扩散法,发现非晶态钛酸钛锆(a-ZTT)薄膜的关键成分的介电常数为50至70,漏电流为10 -9 至10 -7 A / cm 2 在1 MV / cm下。化学气相沉积(CVD)是ZTT膜沉积的一种有吸引力的技术,因为它比溅射沉积具有许多优势。在薄膜微结构和组成的优化中,可以控制和改变许多加工参数。另外,高epsepsiv;通过使用CVD工艺的等离子体增强,可以在低温下实现化合物的固定相。或者,使用臭氧或其他氧化剂可以使金属前体在较低的加工温度下完全氧化。以下讨论详细描述了用于沉积ZTT薄膜的CVD反应器的构造和改进。此外,还讨论了用于沉积ZTT薄膜的前体“鸡尾酒”(包含薄膜中所有金属成分的溶液)的表征。{09}讨论包括表征介电和器件特性(介电常数,介电损耗)的实验。 ,电容和泄漏电流)使用前体“鸡尾酒”制成的CVD生长的a-ZTT薄膜。示出了转化成膜的前体中阳离子比率的关系及其与介电性能的关系的重要性。 ZTT膜的器件性能通过电容电压(CV)和电流电压(IV)分析进行了测量,而介电性能则通过阻抗谱(IS)和光谱椭圆仪(SE)进行了探索。此外,还使用了X射线光电子能谱(XPS),卢瑟福背散射(RBS)和高分辨率透射电子显微镜(HRTEM)来关联成分特征并研究某些形态特征。

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