首页> 外文学位 >Crosstalk noise in deep submicron integrated circuit design.
【24h】

Crosstalk noise in deep submicron integrated circuit design.

机译:深亚微米集成电路设计中的串扰噪声。

获取原文
获取原文并翻译 | 示例

摘要

Crosstalk noise has become a critical design and verification challenge for high-performance integrated circuits in deep submicron technologies. This thesis addresses crosstalk noise at methodological and algorithmic levels at various stages of the physical design flow. It proposes a signal integrity management physical design flow, underlining the changes required in the traditional design flow. Novel algorithms and methodologies are presented in this flow from early noise prevention to accurate and effective noise analysis to postroute noise reduction. Proposed algorithms, techniques and methodologies are evaluated in a system on chip (SoC) context, and several observations and guidelines are presented on the block, platform and chip level design phases of SoC designs. Results are given on several industrial, high-performance 0.13 μm–0.18 μm designs.
机译:串扰噪声已经成为深亚微米技术中高性能集成电路的关键设计和验证挑战。本文在物理设计流程的各个阶段,从方法论和算法论的角度探讨了串扰噪声。它提出了信号完整性管理物理设计流程,强调了传统设计流程中需要进行的更改。从早期的噪声预防到准确有效的噪声分析再到路由后的降噪,本流程中提出了新颖的算法和方法。在片上系统(SoC)上下文中评估了拟议的算法,技术和方法,并在SoC设计的模块,平台和芯片级设计阶段介绍了一些观察结果和指南。给出了几种工业高性能0.13 μm–0.18μm设计的结果。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号