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Growth of gallium nitride on porous silicon carbide substrates.

机译:氮化镓在多孔碳化硅衬底上的生长。

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摘要

Gallium Nitride (GaN) is a wide band gap compound semiconductor. One of the major challenges associated with the growth of GaN crystals is to find a suitable substrate for epitaxial overgrowth of GaN in order to reduce the dislocation density in the film. The use of porous substrates has recently been suggested as an potential solution to this problem. It has been proposed that the porous substrates can lead to defect reduction in the GaN film due to dislocation annihilation and lateral epitaxial overgrowth. The purpose of this thesis is to study the effect of porous substrates for dislocation reduction in the GaN films. We have studied various mechanisms of GaN film growth on porous substrates, primarily porous SiC, and examined how they can lead to dislocation density reduction in the film.; The morphology of the porous network in porous SiC has been studied in detail. The hydrogen etching rates of porous and nonporous SiC have also been measured. Etch rates of porous and nonporous wafers of various miscuts are found to be equal within a factor of two, indicating that the rate-limiting step in the etching process arises from the supply of active etching species from the gas phase. The porous SiC etches slightly faster than the nonporous SiC, which is interpreted simply in terms of the reduced average density of the porous material.; The porous SiC substrates are characterized in terms of their porosity and pore size by using x-ray reflectivity and diffuse x-ray scattering. X-ray reflectivity gives information about the surface porosity of the porous SiC samples. A model has been developed to interpret the diffuse x-ray scattering data from a porous SiC sample in order to measure the average pore size and bulk porosity.; The GaN films on porous SiC were grown by plasma assisted molecular beam epitaxy (PAMBE). We have studied MBE growth of GaN on porous SiC substrates. The effect of the porous SiC substrate on the dislocations and strain in the GaN overgrown film is studied in detail, using various characterization tools including x-ray diffraction, transmission electron microscopy (TEM) and scanning electron microscopy (SEM). TEM images show that the GaN film grown on porous substrates contains open tubes and a low dislocation density in regions between tubes. (Abstract shortened by UMI.)
机译:氮化镓(GaN)是一种宽带隙化合物半导体。与GaN晶体的生长相关的主要挑战之一是找到用于GaN的外延过度生长的合适的衬底,以减小膜中的位错密度。最近已经建议使用多孔基材作为该问题的潜在解决方案。已经提出,由于位错an没和横向外延过度生长,多孔衬底可以导致GaN膜中的缺陷减少。本文的目的是研究多孔衬底对减少GaN薄膜中位错的影响。我们研究了主要在多孔SiC上的多孔衬底上GaN膜生长的各种机理,并研究了它们如何导致膜中位错密度的降低。对多孔SiC中的多孔网络的形态进行了详细研究。还已经测量了多孔和无孔SiC的氢蚀刻速率。发现各种误切的多孔和无孔晶片的蚀刻速率在两倍内相等,这表明蚀刻过程中的限速步骤是由气相提供的活性蚀刻物质引起的。多孔SiC的腐蚀比无孔SiC的腐蚀快一些,这可以用降低的多孔材料平均密度来简单解释。通过使用X射线反射率和漫射X射线散射,以其孔隙率和孔径来表征多孔SiC衬底。 X射线反射率可提供有关多孔SiC样品表面孔隙率的信息。已经开发了一个模型来解释来自多孔SiC样品的漫射X射线散射数据,以便测量平均孔径和整体孔隙率。通过等离子体辅助分子束外延(PAMBE)生长多孔SiC上的GaN膜。我们研究了多孔SiC衬底上GaN的MBE生长。使用包括X射线衍射,透射电子显微镜(TEM)和扫描电子显微镜(SEM)在内的各种表征工具,详细研究了多孔SiC衬底对GaN过生长膜中的位错和应变的影响。 TEM图像显示,在多孔基板上生长的GaN膜包含开口管,且管之间区域的位错密度低。 (摘要由UMI缩短。)

著录项

  • 作者

    Ashutosh.;

  • 作者单位

    Carnegie Mellon University.;

  • 授予单位 Carnegie Mellon University.;
  • 学科 Physics Condensed Matter.; Engineering Materials Science.; Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2004
  • 页码 96 p.
  • 总页数 96
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;无线电电子学、电信技术;
  • 关键词

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