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Effect of post-fill pressure and nanoclay on void morphology in resin transfer molded composites.

机译:后填充压力和纳米粘土对树脂传递模塑复合材料中空隙形态的影响。

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Resin transfer molded (RTM) composites usually suffer from the formation of flow-induced defects such as voids. Detrimental effects of voids on performance of molded parts have been studied extensively. Yet, knowledge of effective void removal strategies, along with detailed morphological void distribution within molded composites is very limited. In this investigation, effects of post-fill pressure on void content is investigated for random-mat, E-glass/epoxy RTM disks. Measured void contents agree well with results obtained in other studies for similar ranges of modified capillary number values. Packing helped significantly reduce void contents in RTM parts. In addition, voids are found to concentrate primarily within or adjacent to the fibers. Three-dimensional features of the formed voids are included in more detailed analyses of morphology variations of voids within the composite from both through-the-thickness and planar surfaces.; Effects of applying a packing pressure on void morphology are investigated for similar composites. Packing pressures of zero and 570 kPa are applied and voidage is evaluated from both through-the-thickness and planar views. The packed composite is found to contain almost 92% less void content than the unpacked composite, accompanied by a 40% drop in average void size. Along the flow direction, removal of voids seems to depend on their arrangement at the end of the filling stage.; Finally, effect of nanoclay content on void morphology in RTM nanoclay/E-glass/epoxy composites are investigated. ClositeRTM25A nanoclay loads of 0, 2, 5, and 10 wt% are mixed with a low-viscosity epoxy resin prior to filling. Void occurrence is observed to increase considerably with increasing nanoclay content from 2.1% in the composite without nanoclay to 5.1 and 8.3% in 5%- and 10%-nanocomposites, respectively. However, the composite with 2 wt% nanoclay yields the lowest void content of 0.7%. Voids are observed to be smaller after the addition of nanoclay at all concentrations.
机译:树脂传递模塑(RTM)复合材料通常会遭受流动引起的缺陷(如空隙)的形成。空隙对模制零件性能的有害影响已得到广泛研究。然而,有效的空隙去除策略以及模制复合材料内详细的形态学空隙分布的知识非常有限。在这项研究中,研究了无垫毡,E玻璃/环氧树脂RTM盘的填充后压力对空隙含量的影响。测得的空隙率与其他研究中获得的结果相似,适用于相似范围的修饰毛细管数值。包装有助于显着减少RTM零件中的空隙含量。另外,发现空隙主要集中在纤维内或附近。所形成的空隙的三维特征包括在复合材料中从整个厚度和平坦表面的空隙形态变化的更详细分析中。对于类似的复合材料,研究了施加填充压力对空隙形态的影响。施加零填充压力和570 kPa,并通过厚度和平面图评估空隙率。发现填充的复合材料比未填充的复合材料包含少近92%的空隙含量,同时平均空隙尺寸降低40%。沿流动方向,空隙的去除似乎取决于填充阶段结束时的排列。最后,研究了纳米粘土含量对RTM纳米粘土/ E-玻璃/环氧树脂复合材料中空隙形态的影响。在填充之前,将0、2、5和10 wt%的ClositeRTM25A纳米粘土负载与低粘度环氧树脂混合。随着纳米粘土含量的增加,从没有纳米粘土的复合材料中的2.1%到5%和10%纳米复合材料中的5.1%和8.3%,空隙发生率显着增加。然而,具有2wt%纳米粘土的复合材料产生0.7%的最低空隙含量。在所有浓度下添加纳米粘土后,观察到的空隙都较小。

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