VOID-CONTAINING RESIN MOLDED PRODUCT, PROCESS FOR PRODUCING THE VOID-CONTAINING RESIN MOLDED PRODUCT, AND IMAGE RECEIVING FILM OR SHEET FOR SUBLIMATION TRANSFER RECORDING MATERIAL OR THERMAL TRANSFER RECORDING MATERIAL

摘要

This invention provides a void-containing resin molded product having a high level of heat insulating properties, and a process for producing the void-containing resin molded product, and a image receiving film or sheet for a sublimation transfer recording material or a thermal transfer recording material, comprising a void-containing resin molded product and having excellent printing properties. The void-containing resin molded product is composed of a crystalline polymer only and has voids in its interior. The void-containing resin molded product is characterized by satisfying a requirement of X/Y ratio = not more than 0.27 wherein X represents the coefficient of thermal conductivity of the void-containing resin molded product, W/mK; and Y represents the coefficient of thermal conductivity of a polymer molded product which has the same thickness as the void-containing resin molded product, is formed of the same crystalline polymer as the crystalline polymer constituting the void-containing resin molded product but free from any void, W/mK.;COPYRIGHT KIPO & WIPO 2010