首页> 外文学位 >MMICs using gallium nitride HEMTs and thin-film BST capacitors.
【24h】

MMICs using gallium nitride HEMTs and thin-film BST capacitors.

机译:使用氮化镓HEMT和薄膜BST电容器的MMIC。

获取原文
获取原文并翻译 | 示例

摘要

GaN HEMTs have been considered as candidate devices for next generation high-power microwave applications. They feature fast speed, high power density, and also low noise. Many research works are underway from material improvement, fabrication development and device optimization. An increasing number of microwave circuits based on GaN HEMTs have been demonstrated, but there are still many challenges to make high-performance integrated microwave circuits. One of these problems is the limited availability of high quality integrated passive components for Monolithic Microwave Integrated Circuits (MMIC). Therefore, the exploration and integration of novel integrated passive components is a key solution to broaden the functionality of GaN MMICs.; Barium Strontium Titanate (BST) tunable capacitors have been studied for years as microwave components because of their high tunability, compact structure, decent quality factor and high capacitance density. In order to optimize the loss in the BST capacitors, a geometry dependent RF model is established to analyze high frequency performance at the device level. Several tunable microwave circuits, such as tunable filters and phase shifters, are demonstrated using these design techniques. Also successful integration of the BST process with GaN HEMT circuits in the form of a 5 GHz GaN HEMT oscillator is presented. BST thin film technology is shown to be useful for the design of frequency agile circuits and reduction of layout area in various microwave application.; In this research, a full MMIC fabrication process has been developed based on GaN HEMTs. BST tunable capacitors, spiral inductors, metal-insulator-metal (MIM) capacitors and thin film resistors have been successfully integrated in GaN HEMT microwave integrated circuits. Field-plated GaN HEMT structures were also employed and analyzed to improve the power and efficiency performance of transistors. Various microwave circuits, including LNAs, oscillators and power amplifiers, were designed and fabricated to study high frequency noise, phase-noise and power behaviors. Results from these circuits show superior properties of GaN MMICs, especially from perspectives of power density and efficiency.
机译:GaN HEMT被认为是下一代大功率微波应用的候选器件。它们具有速度快,功率密度高以及噪声低的特点。材料改进,制造开发和设备优化正在进行许多研究工作。已经证明越来越多的基于GaN HEMT的微波电路,但是制造高性能集成微波电路仍然存在许多挑战。这些问题之一是用于单片微波集成电路(MMIC)的高质量集成无源元件的可用性有限。因此,探索和集成新型集成无源元件是扩展GaN MMIC功能的关键解决方案。钛酸锶钡(BST)可调电容器作为微波组件已经研究了很多年,因为它们具有高可调性,紧凑的结构,良好的品质因数和高电容密度。为了优化BST电容器中的损耗,建立了与几何形状有关的RF模型,以分析器件级的高频性能。使用这些设计技术演示了几种可调微波电路,例如可调滤波器和移相器。还介绍了BST工艺与5 GHz GaN HEMT振荡器形式的GaN HEMT电路的成功集成。事实证明,BST薄膜技术可用于各种微波应用中的频率捷变电路设计和减小布局面积。在这项研究中,已经开发了基于GaN HEMT的完整MMIC制造工艺。 BST可调电容器,螺旋电感器,金属-绝缘体-金属(MIM)电容器和薄膜电阻器已成功集成在GaN HEMT微波集成电路中。还采用了场镀GaN HEMT结构并对其进行了分析,以提高晶体管的功率和效率性能。设计并制造了各种微波电路,包括LNA,振荡器和功率放大器,以研究高频噪声,相位噪声和功率行为。这些电路的结果显示出GaN MMIC的优越性能,尤其是从功率密度和效率的角度来看。

著录项

  • 作者

    Xu, Hongtao.;

  • 作者单位

    University of California, Santa Barbara.;

  • 授予单位 University of California, Santa Barbara.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2005
  • 页码 163 p.
  • 总页数 163
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号