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Epitaxial growth by monolayer restricted galvanic displacement.

机译:单层外延生长限制了电位移。

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摘要

This dissertation investigates a new method for the growth of morphologically flat, epitaxial metal films on single crystal metal substrates. This research is based on the concept of monolayer surface modification assisted by galvanic displacement, utilizing successive potential controlled and electroless deposition steps. The growth of silver thin films on gold single crystal substrate is examined.; In the first part of this study, factors associated with the stability of an underpotentially deposited layer at open circuit potential are quantitatively considered and mathematically modeled. Classical electrochemical tools such as cyclic voltammetry, chronopotentiometry and chronoamperometry are used to investigate the stability of an underpotentially deposited layer at open circuit potential. Simple modeling based on the Lorentzian cumulative function is used to fit the behavior of the underpotentially deposited layer at open circuit potential.; In the second part, electrochemical methods and ex-situ surface characterization techniques (scanning tunneling microscopy, x-ray photoelectron spectroscopy and x-ray diffraction) are employed for studying the growth kinetics of layers. Replacement schedules are optimized with respect to sacrificial layer identity (Tl, Pb or Bi), specific polarization regimes and rate of deposition in order to yield a working protocol for growth of crystallographically well-defined, morphologically flat and inclusion-free thin metal films on single crystal substrates.; The unique nature of the newly developed method (one that combines potential controlled and electroless steps within a single deposition event), is the major result of the work. Epitaxial growth by monolayer restricted galvanic displacement, with its unique ability to provide maximum growth uniformity with minimum external control, is superior to the existing electrodeposition techniques.
机译:本文研究了一种在单晶金属衬底上生长形态平坦的外延金属膜的新方法。这项研究基于通过连续电势控制和化学沉积步骤,通过电位移辅助单层表面改性的概念。检验了银薄膜在金单晶衬底上的生长。在本研究的第一部分中,定量考虑了与电位不足沉积层在开路电位下的稳定性相关的因素,并对其进行了数学建模。使用经典的电化学工具,例如循环伏安法,计时电位法和计时电流法,来研究欠电位沉积层在开路电势下的稳定性。使用基于洛伦兹累积函数的简单模型来拟合欠电位沉积层在开路电位下的行为。在第二部分中,采用电化学方法和非原位表面表征技术(扫描隧道显微镜,X射线光电子能谱和X射线衍射)来研究层的生长动力学。针对牺牲层标识(Tl,Pb或Bi),特定的极化方案和沉积速率,对更换时间表进行了优化,以便为在晶体学上定义明确,形态上平坦且无夹杂物的薄金属膜生长提供可行的协议单晶衬底。新开发方法的独特性(在单个沉积事件中结合了电位控制步骤和化学步骤)是这项工作的主要成果。通过单层受限制的电位移进行外延生长,其独特的能力以最小的外部控制提供最大的生长均匀性,优于现有的电沉积技术。

著录项

  • 作者

    Vasilic, Rastko.;

  • 作者单位

    State University of New York at Binghamton.;

  • 授予单位 State University of New York at Binghamton.;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2006
  • 页码 155 p.
  • 总页数 155
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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