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Process development and microstructural analysis of capacitor filter assemblies using lead free solder preforms.

机译:使用无铅焊料预成型件的电容器滤波器组件的工艺开发和微观结构分析。

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摘要

The goal of this research is process development of Pb-free capacitor filter assemblies of various sizes that use solder preforms in the shape of a washer. The Pb-free alloys considered in this research are near eutectic SAC, Sn-Ag and Indium alloys.; The reflow process is one of the most significant processes in SMT. Studies have shown that control of reflow profiles, especially the cooling rate and TAL, helps to reduce the amount of IMCs generated. A critical step to improve the reliability of Pb-free components is to control the amount of intermetallics by establishing a proper cooling rate during the reflow process.; This research work presents the detailed process development of capacitor filter assemblies starting from generating a reflow profile and finally cross-section and polishing of the samples.
机译:这项研究的目的是开发各种尺寸的无铅电容器滤波器组件的工艺,这些组件使用垫圈形状的焊料预成型件。本研究中考虑的无铅合金是近共晶SAC,Sn-Ag和铟合金。回流过程是SMT中最重要的过程之一。研究表明,控制回流曲线,尤其是冷却速率和TAL,有助于减少IMC的产生。提高无铅组件可靠性的关键步骤是在回流过程中通过建立适当的冷却速率来控制金属间化合物的含量。这项研究工作介绍了电容器滤波器组件的详细工艺开发过程,该过程从生成回流曲线开始,最后是样品的横截面和抛光。

著录项

  • 作者

    Vishwanathan, Krishnan.;

  • 作者单位

    State University of New York at Binghamton.$bIndustrial Engineering.;

  • 授予单位 State University of New York at Binghamton.$bIndustrial Engineering.;
  • 学科 Engineering Industrial.
  • 学位 M.S.
  • 年度 2007
  • 页码 131 p.
  • 总页数 131
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 一般工业技术;
  • 关键词

  • 入库时间 2022-08-17 11:39:52

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