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Electrostatic MEMS actuators using gray-scale technology.

机译:使用灰度技术的静电MEMS执行器。

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摘要

The majority of fabrication techniques used in micro-electro-mechanical systems (MEMS) are planar technologies, which severely limits the structures available during device design. In contrast, the emerging gray-scale technology is an attractive option for batch fabricating 3-D structures in silicon using a single lithography and etching step. While gray-scale technology is extremely versatile, limited research has been done regarding the integration of this technology with other MEMS processes and devices.; This work begins with the development of a fundamental empirical model for predicting and designing complex 3-D photoresist structures using a pixilated gray-scale technique. A characterization of the subsequent transfer of such 3-D structures into silicon using deep reactive ion etching (DRIE) is also provided. Two advanced grayscale techniques are then introduced: First, a double exposure technique was developed to exponentially increase the number of available gray-levels; improving the vertical resolution in photoresist. Second, a design method dubbed compensated aspect ratio dependent etching (CARDE) was created to anticipate feature dependent etch rates observed during gray-scale pattern transfer using deep reactive ion etching (DRIE).; The developed gray-scale techniques were used to integrate variable-height components into the actuation mechanism of electrostatic MEMS devices for the first time. In static comb-drives, devices with 3-D comb-fingers were able to demonstrate >34% improvement in displacement resolution by tailoring their force-engagement characteristics. Lower driving voltages were achieved by reducing suspension heights to decrease spring constants (from 7.7N/m to 2.3N/m) without effecting comb-drive force. Variable-height comb-fingers also enabled the development of compact, voltage-controlled electrostatic springs for tuning MEMS resonators. Devices in the low-kHz range demonstrated resonant frequency tuning >17.1% and electrostatic spring constants up to 1.19 N/m ( 70V).; This experience of integrating 3-D structures within electrostatic actuators culminated in the development of a novel 2-axis optical fiber alignment system using 3-D actuators. Coupled in-plane motion of electrostatic actuators with integrated 3-D wedges was used to deflect an optical fiber both horizontally and vertically. Devices demonstrated switching speeds 1ms, actuation ranges >35pm (in both directions), and alignment resolution 1.25pm. Auto-alignment to fixed indium-phosphide waveguides with 1.6pm resolution in 10 seconds was achieved by optimizing search algorithms.
机译:微机电系统(MEMS)中使用的大多数制造技术都是平面技术,这严重限制了器件设计过程中可用的结构。相比之下,新兴的灰度级技术是使用单个光刻和蚀刻步骤批量生产硅中的3-D结构的一种有吸引力的选择。尽管灰度技术用途极为广泛,但有关此技术与其他MEMS工艺和设备集成的研究很少。这项工作从开发基本经验模型开始,该模型用于使用像素化灰度技术预测和设计复杂的3-D光致抗蚀剂结构。还提供了使用深度反应离子刻蚀(DRIE)将此类3-D结构随后转移到硅中的特征。然后介绍了两种先进的灰度技术:首先,开发了一种双曝光技术以成倍增加可用灰度级的数量;提高光刻胶的垂直分辨率。其次,创建了一种称为补偿纵横比依赖蚀刻(CARDE)的设计方法,以预测在使用深反应离子蚀刻(DRIE)的灰度图案转移过程中观察到的特征依赖蚀刻速率。所开发的灰度技术首次用于将高度可变的组件集成到静电MEMS器件的驱动机构中。在静态梳齿驱动器中,带有3-D梳齿的设备通过调整其力啮合特性,能够证明位移分辨率提高了> 34%。在不影响梳齿驱动力的情况下,通过降低悬架高度以降低弹簧常数(从7.7N / m到2.3N / m),可以实现较低的驱动电压。可变高度的梳状手指还使得能够开发紧凑的压控静电弹簧来调谐MEMS谐振器。低kHz范围内的器件显示出谐振频率调谐> 17.1%,静电弹簧常数高达1.19 N / m(70V)。将3-D结构集成到静电执行器中的经验最终导致了使用3-D执行器的新型2轴光纤对准系统的开发。带有集成3-D楔块的静电致动器的平面内耦合运动用于使光纤水平和垂直偏转。设备的开关速度<1ms,致动范围> 35pm(双向),对准分辨率<1.25pm​​。通过优化搜索算法,可以在不到10秒的时间内自动对准分辨率小于1.6pm的固定磷化铟波导。

著录项

  • 作者

    Morgan, Brian Carl.;

  • 作者单位

    University of Maryland, College Park.;

  • 授予单位 University of Maryland, College Park.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2006
  • 页码 243 p.
  • 总页数 243
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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