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Gallium arsenide and indium gallium arsenide MOS devices with ALD high-k dielectrics.

机译:具有ALD高k电介质的砷化镓和砷化铟镓MOS器件。

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摘要

The search and progress for alternative gate dielectrics have attracted great attention during recent years due to every shrinking device dimensions for silicon based complementary metal-oxide-semiconductor (CMOS) industry. Meanwhile, in order to further push the performance envelope of modern transistors built on strained silicon and germanium, novel devices on III-V semiconductor materials are studied extensively as high priority alternatives. The combination of high-k dielectrics and heterogeneously grown high-mobility compound semiconductors on silicon or silicon-on-insulator (SOI) substrates could meet the growing demands on high switching speed and low operating power. Using III-V semiconductors as conducting channels, these transistors could eventually exhibit much elevated performance promised by high mobility characteristic of the compound semiconductor materials and provide an attractive alternative to silicon based devices.;A study of integrating novel dielectrics on III-V semiconductors is presented, focusing on oxide dielectrics grown by atomic layer deposition (ALD) technique for high performance metal-oxide-semiconductor field effect transistor (MOSFET) applications. This study includes the fabrication and characterization of MOS capacitors, MOS depletion mode (D-mode) and enhancement mode (E-mode) field effect transistors on III-V semiconductor substrates, with strong emphasis on the E-mode MOSFET due to the fact that enhancement mode MOSFET is the technologically most important device in digital circuitry.;Parallel to the research on ALD oxide MOSFETs, a novel high performance MISFET based on self-assembled organic nanodielectrics (SANDs) on gallium-arsenide (GaAs) substrate is fabricated and characterized. Capacitance-voltage and conductance voltage (C-V, G-V) measurements and electrical characterizations on dielectrics, MOSFETs and insulator-semiconductor interfaces are also presented in this study.
机译:由于硅基互补金属氧化物半导体(CMOS)行业的每一种器件尺寸的不断缩小,近年来替代栅介质的搜索和进展引起了人们的极大关注。同时,为了进一步提高构建在应变硅和锗上的现代晶体管的性能范围,作为高优先级替代品,对III-V半导体材料上的新型器件进行了广泛的研究。高k电介质和在硅或绝缘体上硅(SOI)衬底上异质生长的高迁移率化合物半导体的结合可以满足对高开关速度和低工作功率的不断增长的需求。使用III-V半导体作为导电通道,这些晶体管最终将表现出化合物半导体材料的高迁移率特性所承诺的更高的性能,并为基于硅的器件提供有吸引力的替代方法。;在III-V半导体上集成新型电介质的研究是展示的重点是通过原子层沉积(ALD)技术生长的氧化物电介质,用于高性能金属氧化物半导体场效应晶体管(MOSFET)应用。这项研究包括在III-V半导体衬底上制造和表征MOS电容器,MOS耗尽模式(D-mode)和增强模式(E-mode)场效应晶体管,并着重强调E-MOSFET。增强型MOSFET是数字电路中技术上最重要的器件。;与ALD氧化物MOSFET的研究并行,在砷化镓(GaAs)衬底上制造了一种基于自组装有机纳米电介质(SAND)的新型高性能MISFET,并表征。本研究还介绍了电介质,MOSFET和绝缘体-半导体接口上的​​电容-电压和电导电压(C-V,G-V)测量和电特性。

著录项

  • 作者

    Lin, Han Chung.;

  • 作者单位

    Purdue University.;

  • 授予单位 Purdue University.;
  • 学科 Electrical engineering.
  • 学位 Ph.D.
  • 年度 2008
  • 页码 180 p.
  • 总页数 180
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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