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The Distributed and Analytical Estimation of Temperature Field in Electronic Circuits

机译:电子电路温度场的分布和解析估计

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摘要

An original algorithm of concurrent programming and a parallel computer were applied for the numerical optimization of the temperature field distribution in the electronic circuits. The analytical solution of the temperature value was implemented. The genetic algorithm is applied in the computations of the optimal displacement of the components in the circuit. Three different methods of the task and/or domain partitioning in the distributed algorithm are discussed. The analysis of the decomposition methods improves the performance of the algorithm.
机译:将并行编程的原始算法和并行计算机应用于电子电路中温度场分布的数值优化。实施了温度值的解析解。遗传算法被应用于电路中元件的最佳位移的计算。讨论了分布式算法中任务和/或域划分的三种不同方法。分解方法的分析提高了算法的性能。

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