首页> 外文会议>Ultrasonics Symposium (IUS), 2008 IEEE >PMN-PT single crystal thick films on silicon substrate for high-frequency micromachined ultrasonic transducers
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PMN-PT single crystal thick films on silicon substrate for high-frequency micromachined ultrasonic transducers

机译:用于高频微加工超声换能器的硅基板上的PMN-PT单晶厚膜

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In this work, a novel high-frequency ultrasonic transducer structure is realized by using PMNPT-on-silicon technology and silicon micromachining. To prepare the single crystalline PMNPT-on-silicon wafers, a hybrid processing method involving wafer bonding, mechanical lapping and wet chemical thinning is successfully developed. The active element is fixed within the stainless steel needle housing. The measured center frequency and -6 dB bandwidth of the transducer are 35 MHz and 34%, respectively. Owing to the excellent electromechanical property of PMNPT film, the transducer shows good energy conversion performance with a very low insertion loss down to 8.3 dB at the center frequency.
机译:在这项工作中,通过使用硅上的PMNPT技术和硅微加工技术实现了一种新颖的高频超声换能器结构。为了制备单晶硅PMNPT晶片,成功开发了一种包括晶片键合,机械研磨和湿法化学减薄的混合处理方法。有源元件固定在不锈钢针壳内。测得的换能器中心频率和-6 dB带宽分别为35 MHz和34%。由于PMNPT膜具有出色的机电性能,该换能器显示出良好的能量转换性能,并且在中心频率处的插入损耗非常低,低至8.3 dB。

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