ENHANCED ADHESION OFPOLYIMIDE WITH SPUTTERED COPPER BY ARGON PLASMAS FOR MICROELECTRNIC FLEX SUBSTRATES

摘要

Enhanced adhesion of polyimide films such as Kapton E(N) and Upilex S with sputtered copper by argon plasmas was investigated. Peel tests demonstrate this improvement. The enhanced adhesive strengths of sputtered coppers to polyimide films by argon plasmas were strongly affected by surface morphology and surface energy of polyimide films. The surface morphology of polyimide film was investigated by atomic force microscopy (AFM) and the surface energy of the polyimide film was calculated by the sessile drop method that indicated the surface roughness and the surface energy of polyimide films were much increased by argon plasmas that results in much increased peel strengths of sputtered coppers to polyimide films. Electron spectroscopy for chemical analysis (ESCA) observed the increased surface energy on polyimide films by argon plasmas were due to the increased surface compositions of O and N and the increased chemical bonds of C-O and C-N.