首页> 外文会议>Third International Symposium on Defects in Silicon, held during the 195th Meeting of The Electrochemical Society in Seattle, Washington, from May 2-7, 1999. >Influence of rapid thermal annealing on thermal donor formation and oxygen precipitation in czochralski silicon
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Influence of rapid thermal annealing on thermal donor formation and oxygen precipitation in czochralski silicon

机译:快速热退火对czochralski硅中热供体形成和氧沉淀的影响

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Thermal donor (TD) formation and nucleation of oxide precipitates at temperatures in a range of 350-800 deg C have been investigated in Czochralski silicon wafers which were beforehand subjected to rapid thermal annealing (RTA) at 1200 deg C in various atmospheres. The experimental results clearly indicated that hydrogen introduced by the RTA in H-2 atmosphere leads to both enhanced TD formation and enhanced precipitate nucleation at 350-450 deg C. An enhancement rate of the TD formation was found to be independent of initial concentration of interstitial oxygen. On the other hand, vacancy introduced by the RTA in N_2 atmosphere has no contribution to the TD formation, while that drastically enhances the precipitate nucleation at high temperatures, It is also suggested that the RTAs in H_2 and Ar atmospheres introduce a similar defect which enhances effectively the precipitate nucleation at 450-500 deg C. The nucertain defect has no influence on the TD formation so that the defect is not hydrogen-related.
机译:已经在切克劳斯基硅片中研究了在350-800摄氏度范围内的温度下氧化物沉淀物的热施主(TD)形成和成核作用,这些硅晶圆事先已在1200摄氏度的各种气氛中进行了快速热退火(RTA)。实验结果清楚地表明,RTA在H-2气氛中引入的氢会导致TD形成的增强和350-450℃下沉淀物成核的增强。发现TD形成的增强速率与间隙的初始浓度无关氧。另一方面,RTA在N_2气氛中引入的空位对TD的形成没有贡献,而在高温下则大大增强了析出物的成核作用,这也表明H_2和Ar气氛中的RTAs会引入类似的缺陷,从而增加有效地在450-500摄氏度下析出核。核形缺陷对TD的形成没有影响,因此该缺陷与氢无关。

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