【24h】

Corrosion Control in Copper Damascene Process

机译:铜镶嵌工艺中的腐蚀控制

获取原文
获取原文并翻译 | 示例

摘要

Corrosion control is the key for realizing copper damascene interconnection, since the most of the processes are treated in wet chemical atmosphere. In addition to ordinary corrosion due to chemical and galvanic reaction with slurries, a newly found type of corrosion, i.e., pattern specific corrosion was investigated. The corrosion is a kind of anodic corrosion observed only when the damascene process was applied to fabricating copper interconnection for actual ULSI devices. The corrosion occurs after the metal polishing completed, and the electrodes are electrically separated each other. Positive potential is generated to copper electrodes connected with p~+ diffused region against that connected with n+ diffused region of a p junction. The positively biased electrodes corrode quickly especially in diluted slurries rather than in the undiluted slurries, resulting in the pattern specific corrosion. The slurries which have less corrosive characteristics especially in diluted state are required.
机译:腐蚀控制是实现铜镶嵌互连的关键,因为大多数过程都是在湿化学气氛中进行的。除了由于与浆料的化学和电反应引起的普通腐蚀外,还研究了一种新发现的腐蚀类型,即图案比腐蚀。仅当将镶嵌工艺用于实际ULSI器件的铜互连的制造时,才发现这种腐蚀是一种阳极腐蚀。在金属抛光完成之后发生腐蚀,并且电极彼此电隔离。与连接p / n结的n +扩散区的铜电极相比,与p〜+扩散区连接的铜电极产生正电位。正偏压电极会迅速腐蚀,特别是在稀浆液中而不是未稀释浆液中,从而导致图案腐蚀。需要具有较小腐蚀性的浆料,特别是在稀释状态下。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号