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Reducing corrosion in copper damascene processes
Reducing corrosion in copper damascene processes
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机译:减少铜镶嵌工艺中的腐蚀
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摘要
Copper interconnects may be made using the damascene process with reduced copper corrosion. Copper corrosion may be reduced by planarizing through excess copper down to, but not completely through, a copper diffusion barrier layer. The copper diffusion barrier layer may be removed using a different technique. Thereafter, suitable chemicals may be utilized to clean the structure.
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