PROCESS INTEGRATION ISSUES WHILE IMPLEMENTING CHEMICAL MECHANICAL PLANARIZATION (CMP) INTO EXISTING PROCESS TECHNOLOGIES

摘要

Several process integration implications arise while implementing Chemical Mechanical Planarization (CMP) into existing process technologies. These implications if not addressed properly can diminish the advantages of CMP in terms of wafer processing costs, end of line yield and ease of manufacturing. This paper will discuss integration solutions that have been implemented in high volume manufacturing successfully. Results of various integration schemes designed to resolve the following problems will be presented: bleach-out steps, variation in post reverse active etch oxide thickness, removal rate variations for Pre-Metal Dielectric (PMD) at CMP, dishing in damascene structures. General strategy for running a CMP area in high volume manufacturing for facilities with numerous products will also be discussed. Results of production CMP metrics obtained by utilizing the above mentioned integration schemes and strategy will also be presented.