首页> 外文会议>Thin film transistors 10(TFT 10) >The 1/f Noise Performance for TFTs Fabricated in Three TFT Technologies:Monocrystalline Silicon on Glass, Low Temperature Polysilicon on Glass, and Silicon on Insulator
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The 1/f Noise Performance for TFTs Fabricated in Three TFT Technologies:Monocrystalline Silicon on Glass, Low Temperature Polysilicon on Glass, and Silicon on Insulator

机译:采用三种TFT技术制造的TFT的1 / f噪声性能:玻璃上的单晶硅,玻璃上的低温多晶硅和绝缘体上的硅

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摘要

Thin film transistors (TFTs) form the building blocks for display pixel drivers and imaging sensors. For sensing systems, the TFT intrinsic low frequency noise performance is one of the primary factors limiting dynamic range and signal-to-noise ratio (1). Recently, a low temperature monocrystalline thin-film silicon on glass (Corning® SiOG) CMOS process technology has been developed to offer improved performance for display driver electronics (2) (3). The SiOG process technology has been designed to minimize the number of mask layers and processing steps in order to reduce cost and increase display panel yield. An NMOSFET is built in a thin-film p-type substrate and operates as a conventional inversion channel device with n+ source and drain regions. The PMOSFET is created in the same p-type thin-film substrate with p+ source and drain regions. The flatband voltage can be adjusted to equal the negative magnitude of the NMOS threshold voltage producing a fully depleted thin-film channel in the PMOSFET with zero gate voltage. PMOSFET channel conduction results by operating the device in accumulation, providing complementary MOS structures in a single Fermi-level process technology. In this paper, the 1/f noise performance of SiOG devices is compared to
机译:薄膜晶体管(TFT)构成了用于显示像素驱动器和成像传感器的构件。对于传感系统,TFT固有的低频噪声性能是限制动态范围和信噪比的主要因素之一(1)。最近,已开发出一种低温单晶玻璃上薄膜硅(Corning®SiOG)CMOS工艺技术,以提高显示驱动器电子设备的性能(2)(3)。 SiOG制程技术旨在减少掩模层和加工步骤的数量,以降低成本并提高显示面板的产量。 NMOSFET内置在薄膜p型衬底中,并作为具有n +源极和漏极区的常规反转沟道器件工作。 PMOSFET在具有p +源极和漏极区的同一p型薄膜衬底中创建。可以将平带电压调整为等于NMOS阈值电压的负值,以在栅极电压为零的情况下在PMOSFET中产生完全耗尽的薄膜沟道。 PMOSFET沟道导通通过累积操作该器件而产生,并在单一费米级工艺技术中提供互补的MOS结构。本文将SiOG器件的1 / f噪声性能与

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  • 来源
    《Thin film transistors 10(TFT 10)》|2010年|p.71-81|共11页
  • 会议地点 Las Vegas NV(US);Las Vegas NV(US)
  • 作者单位

    Department of Electrical Engineering, Analog Devices Integrated Microsystems Laboratory, Rochester Institute of Technology, Rochester, New York 14623, USA;

    Department of Electrical Engineering, Analog Devices Integrated Microsystems Laboratory, Rochester Institute of Technology, Rochester, New York 14623, USA;

    Advanced Display Research Center, Kyung Hee University, Seoul, Korea;

    Advanced Display Research Center, Kyung Hee University, Seoul, Korea;

    Corning Incorporated, Science and Technology, Corning, New York 14870, USA;

    et al;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 半导体技术;
  • 关键词

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