Ceramic-metal composites as a solution for high-performance semiconductor laser packaging

摘要

Abstract: Packaging is one of the most critical operation in optoelectronics manufacturing. Optoelectronic packages for semiconductor laser diodes must provide submicron alignment between optical elements, high-speed electrical connections, excellent heat dissipation, and high reliability. We propose the use of composite substrate materials that simplify the design of optoelectronic packages, improve thermal and mechanical performance, and are suitable for high- reliability applications.!3