Laser Direct-Write Fabrication of Electronic Circuits on Polymer Substrates

摘要

1. Laser forward transfer technology is shown capable of rapid, high-resolution patterning of materials: 1.1 Masks and multiple-step lithographic processes are obviated; 1.2 High-speed patterning can be accomplished in seconds. 2. Integrated Direct-Write Micromachining greatly extends the utility and capability of the system: 2.1 "Mill & Fill" offers rapid, high-resolution patterning; 2.2 Metal plating seed layers directly patterned; 2.3 Via-drilling, trimming, etc. 3. Direct-Write offers flexibility, decreasing time to market: 3.1 Design changes are made in CAD and executed immediately; 3.2 Process is ideal for prototypes and limited production runs.