Flexible Electronics: A General Surface Swelling‐Induced Electroless Deposition Strategy for Fast Fabrication of Copper Circuits on Various Polymer Substrates (Adv. Mater. Interfaces 14/2017)

著录项

• 来源
  《Advanced materials interfaces 》 |2017年第14期| 共1页
• 作者

  Sun Xueyan; Zhang Lijing; Tao Shengyang; Yu Yongxian; Li Sijie; Wang Han; Qiu Jieshan;

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• 作者单位

  Department of ChemistryDalian University of TechnologyDalian 116024 China;

  Department of ChemistryDalian University of TechnologyDalian 116024 China;

  Department of ChemistryDalian University of TechnologyDalian 116024 China;

  Department of ChemistryDalian University of TechnologyDalian 116024 China;

  Department of ChemistryDalian University of TechnologyDalian 116024 China;

  Department of ChemistryDalian University of TechnologyDalian 116024 China;

  State Key Lab of Fine ChemicalsDalian University of TechnologyDalian 116024 China;

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• 收录信息
• 原文格式 PDF
• 正文语种 eng
• 中图分类 特种结构材料 ;
• 关键词

  copper circuits; electroless deposition; flexible electronics; swelling‐induced;

  机译：铜电路;无电沉积;柔性电子;肿胀诱导;