首页> 外文会议>Symposium on Thin Films: Stresses and Mechanical Properties IX, Nov 26-30, 2001, Boston, Massachusetts, U.S.A. >Direction Dependent Grain-Interaction Models for the Diffraction Stress Analysis of Thin Films
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Direction Dependent Grain-Interaction Models for the Diffraction Stress Analysis of Thin Films

机译:薄膜衍射应力分析的方向相关晶粒相互作用模型

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The well-known grain-interaction models for the description of the macroscopic elastic behaviour of polycrystalline specimens, for example the models due to Voigt and Reuss, may be applied to bulk specimens, but they are generally not suitable for thin films because they imply macroscopic elastic isotropy of the body. A thin film is usually at most transversely elastically isotropic, even in the absence of texture. A recently elaborated, alternative model for grain-interaction in thin films, adopting grain-interaction assumptions first given by Vook and Witt (J. Appl. Phys. 7, 2169 (1965)), is able to predict the transversely isotropic elastic behaviour. Although this model is more appropriate for thin films than traditional models, it still imposes extreme grain-interaction assumptions, which are in general not compatible with the true elastic behaviour of real specimens. In this paper a more general approach to grain-interaction in thin films is proposed.
机译:描述多晶试样宏观弹性行为的众所周知的晶粒相互作用模型(例如,由于Voigt和Reuss引起的模型)可以应用于块状试样,但由于它们暗示宏观,因此通常不适用于薄膜。身体的弹性各向同性。即使没有纹理,薄膜通常最多也是横向弹性各向同性的。最近详细阐述的薄膜中晶粒相互作用的替代模型采用了Vook和Witt首先给出的晶粒相互作用假设(J. Appl。Phys。7,2169(1965)),能够预测横向各向同性的弹性行为。尽管该模型比传统模型更适合于薄膜,但是它仍然提出了极端的颗粒相互作用假设,这些假设通常与真实样本的真实弹性行为不兼容。在本文中,提出了一种更通用的薄膜中晶粒相互作用的方法。

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