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Direction dependent grain-interaction models for the diffraction stress analysis of thin films

机译:薄膜衍射应力分析的方向依赖性晶粒相互作用模型

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The well-known grain-interaction models for the description of the macroscopic elastic behaviour of polycrystalline specimens, for example the models due to Voigt and Reuss, may be applied to bulk specimens, but they are generally not suitable for thin films because they imply macroscopic elastic isotropy of the body. A thin film is usually at most transversely elastically isotropic, even in the absence of texture. A recently elaborated, alternative model for grain-interaction in thin films, adopting grain-interaction assumptions first given by Vook and Witt (J. Appi. Phys. 7, 2169 (1965)), is able to predict the transversely isotropic elastic behaviour. Although this model is more appropriate for thin films than traditional models, it still imposes extreme grain-interaction assumptions, which are in general not compatible with the true elastic behaviour of real specimens. In this paper a more general approach to grain-interaction in thin films is proposed.
机译:众所周知的晶粒相互作用模型,用于描述多晶样本的宏观弹性行为,例如由于voigt和Reuss引起的模型,可以应用于散装样本,但它们通常不适合薄膜,因为它们意味着宏观身体的弹性各向同性。即使在没有质地的情况下,薄膜通常是最横向弹性的各向同性的。最近详细阐述的薄膜晶粒相互作用的替代模型,采用VOOK和WITT首先给予的谷物相互作用假设(J. Appi。物理。7,2169(1965)),能够预测横向各向同性的弹性行为。虽然这种模型比传统模型更适合薄膜,但它仍然施加了极端的谷物相互作用假设,这通常与真品的真正弹性行为不相容。本文提出了一种更一般的晶体晶体相互作用的方法。

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