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Thermoelectric transport properties of ReSi_(1.75) thin films

机译:ReSi_(1.75)薄膜的热电输运特性

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摘要

Epitaxial ReSi_(1.75) thin films of variable thickness between 15nm and 150nm have been prepared in an one step process by Facing Target Sputtering (FTS) onto heated (100) and (111)Si and SOS wafers. The epitaxial relations and film structure have been investigated by X-ray diffraction and transmission electron microscopy. Epitaxial growth was found at a substrate temperature of 1070K. Thermoelectric properties were measured between 100K and 450K and compared to the transport behavior of builk ReSi_(1.75) and polycrystalline films. A distinct dependence of both the conductivity and thermopower was found on the film thickness, on unintentional doping and on the film structure. The results show that epitaxial ReSi_(1.75) films prepared by FTS can be a basis for further investigations of thermoelectric silicide/silicon multilayers.
机译:通过面向目标溅射(FTS)到加热的(100)和(111)Si和SOS晶圆上的一步法制备了厚度在15nm至150nm之间的外延ReSi_(1.75)薄膜。通过X射线衍射和透射电子显微镜研究了外延关系和膜结构。在1070K的衬底温度下发现外延生长。测量了100K至450K的热电性能,并将其与块状ReSi_(1.75)和多晶膜的传输行为进行了比较。发现电导率和热功率对膜厚度,无意掺杂和膜结构都有明显的依赖性。结果表明,FTS制备的外延ReSi_(1.75)薄膜可作为进一步研究热电硅化物/硅多层膜的基础。

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