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Thermoelectric transport properties of ReSi_(1.75) thin films

机译:Resi_(1.75)薄膜的热电传输性能

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Epitaxial ReSi_(1.75) thin films of variable thickness between 15nm and 150nm have been prepared in an one step process by Facing Target Sputtering (FTS) onto heated (100) and (111)Si and SOS wafers. The epitaxial relations and film structure have been investigated by X-ray diffraction and transmission electron microscopy. Epitaxial growth was found at a substrate temperature of 1070K. Thermoelectric properties were measured between 100K and 450K and compared to the transport behavior of builk ReSi_(1.75) and polycrystalline films. A distinct dependence of both the conductivity and thermopower was found on the film thickness, on unintentional doping and on the film structure. The results show that epitaxial ReSi_(1.75) films prepared by FTS can be a basis for further investigations of thermoelectric silicide/silicon multilayers.
机译:通过面对加热(100)和(111)Si和SOS晶片,通过面对目标溅射(FTS)和(111)Si和SOS晶片,在一个步骤过程中制备了15nm和150nm之间的可变厚度的薄膜。通过X射线衍射和透射电子显微镜研究了外延关系和膜结构。在1070K的底物温度下发现外延生长。在100k和450k之间测量热电性能,并与Builk Resi_(1.75)和多晶膜的运输行为相比。在薄膜厚度上发现了导电性和散热器的不同依赖性,无意中掺杂和膜结构。结果表明,FTS制备的外延Resi_(1.75)薄膜可以是进一步研究热电硅化物/硅多层的基础。

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