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Mechanisms for Interstitial-Mediated Transient Enhanced Diffusion of N-Type Dopants

机译:间隙介导的N型掺杂物瞬态增强扩散的机制

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As silicon transistors scale down, transient enhanced diffusion of n-type dopants has become a barrier toward achieving required junction depths for transistors. In this paper, we use density functional calculations to identify a pathway by which silicon interstitials (Si_i) mediate As and P diffusion. We show that As-Si_i and P-Si_i pairs in the neutral and negative charge states diffuse via a mechanism in which the dopant is bond-centered at energy minima and threefold coordinated at the high energy saddle point during dopant migration. For both As-Si_i and P-Si_i pairs, we conclude that neutral pairs will dominate under intrinsic conditions while the neutral and negatively charged pairs will both contribute under heavily doped extrinsic conditions.
机译:随着硅晶体管按比例缩小,n型掺杂剂的瞬态增强扩散已成为实现晶体管所需结深的障碍。在本文中,我们使用密度泛函计算来确定硅间隙(Si_i)介导As和P扩散的途径。我们显示,在中性和负电荷状态下,As-Si_i和P-Si_i对通过一种机制扩散,在该机制中,掺杂剂迁移过程中,掺杂剂以能量最小值为键中心,并在高能量鞍点处为三倍配位。对于As-Si_i和P-Si_i对,我们得出结论,中性对将在本征条件下占主导地位,而中性和带负电的对将在重掺杂非本征条件下均发挥作用。

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